You provide us with the design of your microfluidic chip (3D CAD).
We realize the tool insert with our unique ultra precision milling process (UPM).
We mold 100 extremely precise plastic slides.
We seal the channels of your devices with our proprietary bonding process.
We re-format your 2D-data (DXF) in 3-D-data.
Additional 100 sealed chips:
Additional 500 sealed chips:
Additional 1000 sealed chips:
We functionalize (hydrophilization or hydrophobization according to the standard processes of thinXXS) the surface of your microfluidic chips.
Note: errors and omissions excepted! All prices plus VAT & shipping. Our General Terms & Conditions apply.
The injection moulding process described in this document is adapted for the manufacturing of macroscopic parts with a footprint of 25.5 x 75.5 mm▓ containing microscopic structures like channels, cavities or pillars with typical dimensions in the range of 50 Ám to 500 Ám.
If you would like to design a plastics part according to this design guidelines and need further information or support, please contact: email@example.com. To place an order, please contact: firstname.lastname@example.org.