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thinXXS - Mikrotechnologie
:: Competence

Integration of sensors, bonding technology, micro assembling and surface modification

thinXXS is specialized in hybrid systems, which normally combine several components made of different materials to accomodate complex requirements of multifunctional, microfluidic products.

Here we use technologies to condition and functionalize surfaces with wet-chemical and plasma methods, laser-, welding- and bonding-processes as well as intelligent concepts to integrate sensors and actuators.

About three quarters of the production costs for plastic microsystems are due to finishing and mounting processes as well as to connecting the miniscule devices to their macroscopic surroundings.
In this phase thinXXS relies on its extensive know-how in glueing, bonding, or welding to assemble, for example, medical, optical, mechanical, or microchemical components.

Other typical backend processes are the integration of gold or platinum microelectrodes on polymer surfaces, the systematic manipulation of surface properties like hydrophilicity and hydrophobicity, or the local coupling of functional groups as used in many life science applications.

The functionality of microfluidic products relies beside the size and tolerances of the micro features mainly on the surface properties due to the comparable large surface to volume ratio.

Our process technology for coating and conditioning microstructured plastic components allows to adapt and extend the product functions by electrical, optical, fluidic or even chemical properties. These are for example, the application of conductive tracks and highly reflective coatings, the coating of plastics by glass-like layers, the hydrophilic or hydrophobic surface modification, the application of functional groups adapted to specific molecular interactions or the increase of the chemical resistance.

Precision assembly
Microfluidic disposables are mounted plastic devices extended with other elements like sensors, actors, microarrays, electronic control units and PCBs as well as mechanical, electrical and fluidical interfaces. In the end everything has to be tested and packaged.

The products we make can be used without other fabrication steps. Our technological platform combines techniques of plastic injection molding with semi-conductor techniques. This includes precision assembling of microparts up to active alignment, bonding technologies like laser welding and chemical or physical supported bonding and gluing. Furthermore we integrate sensitive components like glass, silicon, ceramic or metal. 

All process steps are optimized for large scale production. That enables our customers to forecast the volume, time and costs of a production.

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